T2000 EPP PKG BOARD

Advantest T2000 EPP Board

 

 

Layer : Max 64 Layer
Thickness : 6.35mm
Material : FR-4, NELCO, TEFRON
Size : 6800*520
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



T2000 PKG BOARD

Advantest T2000 Board

 

 

Layer : Max 48 Layer
Thickness : 4.8mm
Material : FR-4, NELCO, TEFRON
Size : 550*480
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



UltraFLEX XD PKG BOARD

Teradyne UltraFLEX XD Board

 

 

Layer : Max 64 Layer
Thickness : 6.35mm
Material : FR-4, NELCO, TEFRON
Size : 580*406
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



UltraFLEX PKG BOARD

Teradyne UltraFLEX Board

 

 



 

Layer : Max 48 Layer
Thickness : 4.8mm
Material : FR-4, NELCO, TEFRON
Size : 580*406
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

J750(IP750) LOAD BOARD

 

 

Teradyne J750(IP750) Load Board

 

 

 

 Layer : Max 36 Layer
Thickness : 3.2mm
Material : FR-4, NELCO, TEFRON
Size : 340x340
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100,90 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



QUARTET BOARD

 

QUARTET BOARD

 

 



 Layer : Max 36 Layer
Thickness : 3.2mm
Material : FR-4, NELCO, TEFRON
Size : 480x450
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100,90 Ω ± 10% (7%,5%)
Dut : ~16DUT

J750(IP750) PROBE CARD

Teradyne J750(IP750) Probe Card

 

 

 

Layer : Max 50 Layer
Thickness : 4.8mm
Material : FR-4, NELCO, TEFRON
Size : 304mm
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100,90 Ω ± 10% (7%,5%)
Dut : ~16DUT