Advantest T2000 EPP Board
Layer : Max 64 Layer
Thickness : 6.35mm
Material : FR-4, NELCO, TEFRON
Size : 6800*520
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT
Thickness : 6.35mm
Material : FR-4, NELCO, TEFRON
Size : 6800*520
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT
