T2000 EPP PKG BOARD

Advantest T2000 EPP Board

 

 

Layer : Max 64 Layer
Thickness : 6.35mm
Material : FR-4, NELCO, TEFRON
Size : 6800*520
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



T2000 PKG BOARD

Advantest T2000 Board

 

 

Layer : Max 48 Layer
Thickness : 4.8mm
Material : FR-4, NELCO, TEFRON
Size : 550*480
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



UltraFLEX XD PKG BOARD

Teradyne UltraFLEX XD Board

 

 

Layer : Max 64 Layer
Thickness : 6.35mm
Material : FR-4, NELCO, TEFRON
Size : 580*406
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



UltraFLEX PKG BOARD

Teradyne UltraFLEX Board

 

 



 

Layer : Max 48 Layer
Thickness : 4.8mm
Material : FR-4, NELCO, TEFRON
Size : 580*406
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : ~16DUT

J750(IP750) LOAD BOARD

 

 

Teradyne J750(IP750) Load Board

 

 

 

 Layer : Max 36 Layer
Thickness : 3.2mm
Material : FR-4, NELCO, TEFRON
Size : 340x340
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100,90 Ω ± 10% (7%,5%)
Dut : ~16DUT

 



QUARTET BOARD

 

QUARTET BOARD

 

 



 Layer : Max 36 Layer
Thickness : 3.2mm
Material : FR-4, NELCO, TEFRON
Size : 480x450
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100,90 Ω ± 10% (7%,5%)
Dut : ~16DUT

J750(IP750) PROBE CARD

Teradyne J750(IP750) Probe Card

 

 

 

Layer : Max 50 Layer
Thickness : 4.8mm
Material : FR-4, NELCO, TEFRON
Size : 304mm
Min Pitch : 0.35mm Pitch
Option : HPL, BVH, Back Drill
Impedance Control : 50,100,90 Ω ± 10% (7%,5%)
Dut : ~16DUT



Hi-Fix Socket Board

Memory Test Socket Board

 

 

Layer : Max 20 Layer
Thickness : 6.6mm
Material : FR-4
Size : 150*100
Min Pitch : 0.35mm Pitch
Option : HPL, Build  Up
Laser Drill : 65um
Dut : ~2DUT



UltraFLEX XD EDS BOARD

Teradyne UltraFLEX XD Board

 

 

 

Layer : Max 58 Layer
Thickness : 6.35mm
Material : FR-4
Size : 406*406
Option : HPL + BUILD UP
Impedance Control : 50,90,100 Ω ± 10% (7%,5%)
Dut : 8DUT



UltraFLEX EDS BOARD

Teradyne UltraFLEX Board

 

 

Layer : Max 40 Layer
Thickness : 4.8mm
Material : FR-4
Size : 406*406
Option : Normal
Impedance Control : 50,100 Ω ± 10% (7%,5%)
Dut : 8DUT

 

 

 

FLEX EDS BOARD

Teradyne FLEX(i-Flex) Board

 

 

Layer : Max 30 Layer
Thickness : 4.8mm
Material : FR-4
Size : 406*406
Option : Normal
Impedance Control : 50,90Ω ± 10% (7%,5%)
Dut : 1DUT

HP93K PKG BOARD

HP93K PKG BOARD

 

 

Layer : Max 26 Layer
Thickness : 3.2mm
Material : 외층 NELCO + FR-4
Size : 293*430
Min Pitch : 0.5mm Pitch, TB DRILL
Option : HPL
Impedance Control : 50,90,100 Ω ± 10% (7%,5%)
Dut : 1DUT

FLEX PKG BOARD

 

Teradyne FLEX(i-Flex) Tester Board

 

 

Layer : Max 28 Layer
Thickness : 3.2mm
Material : FR-4
Size : 406*406
Min Pitch : 0.65mm Pitch
Option : HPL
Impedance Control : 50,90 Ω ± 10% (7%,5%)
Dut : 2DUT

CATA PKG BOARD

Teradyne Catalyst Board

 

 

 

Layer : Max 28 Layer
Thickness : 3.2mm
Size : 385*342
0.5mm Pitch, TB DRILL
Option: HPL,
1DUT